5962-01-288-6900, 5962012886900 (Microcircuit Memory) - National Stock Number Lookup
NSN 5962-01-288-6900 of part number TBP24S10N9, ROM PROM HEAD 005, M3851C 20302 BEB, M3851C 20302 BEB, M3851C 20302 BEB, M38510 20302BEB, M38510 20302BEB, M38510 20302BEB, HM1-7611-8, HL7611E1, HL7611, G267767-1, ED1365-001, 82S129N, 69020700-04, 5962-3820302BEX, 5962-3820302BEX, 5962-3820302BEX, 5962-3820302BEA, 5962-3820302BEA by the manufacturer, Dla Land And Maritime, Fairchild Semiconductor Corp, General Dynamics Information Systems, Hewlett Packard Co, Intersil Inc is in stock and ready to ship out. We make NSN parts purchasing as simple as possible. We list corresponding components such as 5962-01-288-6900 so that you can make the purchasing decision that is right for you. Our dedicated team are on hand to help source any-hard-find NSN parts or answer any procurement questions. We only source from manufacturers we trust and are the only independent distributor with a NO CHINA SOURCING policy. Unlike other companies, we pair every customer with a dedicated account manager. We respond to all RFQs within 15 minutes. Submit an RFQ today to get started.
5962-01-288-6900 NSN Information
Alternative NSN: 5962-01-288-6900 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012886900 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime, Fairchild Semiconductor Corp, General Dynamics Information Systems, Hewlett Packard Co, Intersil Inc, Lansdale Semiconductor Inc, Mmi Amd, Raytheon Company, Rockwell Collins Inc, Texas Instruments Incorporated, University Of Texas At Austin |
NSN 5962-01-288-6900 Manufacturing Part Numbers
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
TBP24S10N9 | texas instruments incorporated | microcircuit memory | Avl | RFQ |
ROM PROM HEAD 005 | dla land and maritime | microcircuit memory | Avl | RFQ |
M3851C 20302 BEB | university of texas at austin | microcircuit memory | Avl | RFQ |
M3851C 20302 BEB | general dynamics information systems | microcircuit memory | Avl | RFQ |
M3851C 20302 BEB | dla land and maritime | microcircuit memory | Avl | RFQ |
M38510 20302BEB | university of texas at austin | microcircuit memory | Avl | RFQ |
M38510 20302BEB | general dynamics information systems | microcircuit memory | Avl | RFQ |
M38510 20302BEB | dla land and maritime | microcircuit memory | Avl | RFQ |
HM1-7611-8 | intersil inc | microcircuit memory | Avl | RFQ |
HL7611E1 | lansdale semiconductor inc | microcircuit memory | Avl | RFQ |
HL7611 | lansdale semiconductor inc | microcircuit memory | Avl | RFQ |
G267767-1 | raytheon company | microcircuit memory | Avl | RFQ |
ED1365-001 | university of texas at austin | microcircuit memory | Avl | RFQ |
82S129N | fairchild semiconductor corp | microcircuit memory | Avl | RFQ |
69020700-04 | general dynamics information systems | microcircuit memory | Avl | RFQ |
5962-3820302BEX | university of texas at austin | microcircuit memory | Avl | RFQ |
5962-3820302BEX | general dynamics information systems | microcircuit memory | Avl | RFQ |
5962-3820302BEX | dla land and maritime | microcircuit memory | Avl | RFQ |
5962-3820302BEA | university of texas at austin | microcircuit memory | Avl | RFQ |
5962-3820302BEA | general dynamics information systems | microcircuit memory | Avl | RFQ |
5962-3820302BEA | dla land and maritime | microcircuit memory | Avl | RFQ |
5301-1D 883B | mmi amd | microcircuit memory | Avl | RFQ |
5201-1J | mmi amd | microcircuit memory | Avl | RFQ |
351-8893-010 | mmi amd | microcircuit memory | Avl | RFQ |
351 8893 010 | rockwell collins inc | microcircuit memory | Avl | RFQ |
1816-0005 | hewlett packard co | microcircuit memory | Avl | RFQ |
1816-0005 | university of texas at austin | microcircuit memory | Avl | RFQ |
1816-0005 | general dynamics information systems | microcircuit memory | Avl | RFQ |
1816-0005 | dla land and maritime | microcircuit memory | Avl | RFQ |
Product Specification of NSN 5962012886900
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 739.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | SCHOTTKY AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/203 GOVERNMENT SPECIFICATION |
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