5962-01-248-5010, 5962012485010 (Microcircuit Memory) - National Stock Number Lookup
NSN 5962-01-248-5010 of part number SCD0635, SCD0326, IDT6167LA70LB, IDT6167L70LB, DEL1403N-70LM, 7566356-003 by the manufacturer, General Dynamics Land Systems Inc, Integrated Device Technology Inc, Sgs Thomson Microelectronics Inc is in stock and ready to ship out. We make NSN parts purchasing as simple as possible. We list corresponding components such as 5962-01-248-5010 so that you can make the purchasing decision that is right for you. Our dedicated team are on hand to help source any-hard-find NSN parts or answer any procurement questions. We only source from manufacturers we trust and are the only independent distributor with a NO CHINA SOURCING policy. Unlike other companies, we pair every customer with a dedicated account manager. We respond to all RFQs within 15 minutes. Submit an RFQ today to get started.
5962-01-248-5010 NSN Information
| Alternative NSN: 5962-01-248-5010 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012485010 |
| NCB Code: USA (01) |
| Manufacturers: General Dynamics Land Systems Inc, Integrated Device Technology Inc, Sgs Thomson Microelectronics Inc |
NSN 5962-01-248-5010 Manufacturing Part Numbers
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| SCD0635 | integrated device technology inc | microcircuit memory | Avl | RFQ |
| SCD0326 | integrated device technology inc | microcircuit memory | Avl | RFQ |
| IDT6167LA70LB | integrated device technology inc | microcircuit memory | Avl | RFQ |
| IDT6167L70LB | integrated device technology inc | microcircuit memory | Avl | RFQ |
| DEL1403N-70LM | sgs thomson microelectronics inc | microcircuit memory | Avl | RFQ |
| 7566356-003 | general dynamics land systems inc | microcircuit memory | Avl | RFQ |
Product Specification of NSN 5962012485010
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.085 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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