5962-01-306-5562, 5962013065562 (Microcircuit Memory) - National Stock Number Lookup
NSN 5962-01-306-5562 of part number 10133848, 14521420-2, 5962 88525, 5962 8852503XX, 5962-8764903XX, 5962-8852503XA, 5962-8852503XA, 5962-8852503XA, 5962-8852503XB, 5962-8852503XB, 5962-8852503XB, 8502736-417, 8502736-417, 8502736-417, 8764902XX, AT28C256-25DM 883, DM28C256 250 B, DM28C256-250 B, DM28C256-250 B, DM28C256-250 B by the manufacturer, Atmel Corporation, Dla Land And Maritime, Honeywell International Inc, Paaesikunta Logistiikkaosasto, Safran is in stock and ready to ship out. We make NSN parts purchasing as simple as possible. We list corresponding components such as 5962-01-306-5562 so that you can make the purchasing decision that is right for you. Our dedicated team are on hand to help source any-hard-find NSN parts or answer any procurement questions. We only source from manufacturers we trust and are the only independent distributor with a NO CHINA SOURCING policy. Unlike other companies, we pair every customer with a dedicated account manager. We respond to all RFQs within 15 minutes. Submit an RFQ today to get started.
5962-01-306-5562 NSN Information
| Alternative NSN: 5962-01-306-5562 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013065562 |
| NCB Code: USA (01) |
| Manufacturers: Atmel Corporation, Dla Land And Maritime, Honeywell International Inc, Paaesikunta Logistiikkaosasto, Safran, Seeq Technology Inc, Xicor Ltd |
NSN 5962-01-306-5562 Manufacturing Part Numbers
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 10133848 | paaesikunta logistiikkaosasto | microcircuit memory | Avl | RFQ |
| 14521420-2 | safran | microcircuit memory | Avl | RFQ |
| 5962 88525 | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962 8852503XX | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8764903XX | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8852503XA | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8852503XA | honeywell international inc | microcircuit memory | Avl | RFQ |
| 5962-8852503XA | atmel corporation | microcircuit memory | Avl | RFQ |
| 5962-8852503XB | honeywell international inc | microcircuit memory | Avl | RFQ |
| 5962-8852503XB | atmel corporation | microcircuit memory | Avl | RFQ |
| 5962-8852503XB | dla land and maritime | microcircuit memory | Avl | RFQ |
| 8502736-417 | honeywell international inc | microcircuit memory | Avl | RFQ |
| 8502736-417 | dla land and maritime | microcircuit memory | Avl | RFQ |
| 8502736-417 | atmel corporation | microcircuit memory | Avl | RFQ |
| 8764902XX | dla land and maritime | microcircuit memory | Avl | RFQ |
| AT28C256-25DM 883 | atmel corporation | microcircuit memory | Avl | RFQ |
| DM28C256 250 B | seeq technology inc | microcircuit memory | Avl | RFQ |
| DM28C256-250 B | dla land and maritime | microcircuit memory | Avl | RFQ |
| DM28C256-250 B | atmel corporation | microcircuit memory | Avl | RFQ |
| DM28C256-250 B | honeywell international inc | microcircuit memory | Avl | RFQ |
| X28C256DMB-25 | honeywell international inc | microcircuit memory | Avl | RFQ |
| X28C256DMB-25 | dla land and maritime | microcircuit memory | Avl | RFQ |
| X28C256DMB-25 | atmel corporation | microcircuit memory | Avl | RFQ |
| X28C256DMB-25 | xicor ltd | microcircuit memory | Avl | RFQ |
Product Specification of NSN 5962013065562
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | 1270-01-142-2855 TARGET DESIGNAT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.25 VOLTS MAXIMUM TOTAL SUPPLY |
| CZER | MEMORY DEVICE TYPE | EEPROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
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